BS EN 62047-4-2010 半导体装置.微电机装置.微电子机械系统(MEMS)一般规格

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【英文标准名称】:Semiconductordevices.Micro-electromechanicaldevices.GenericspecificationforMEMS
【原文标准名称】:半导体装置.微电机装置.微电子机械系统(MEMS)一般规格
【标准号】:BSEN62047-4-2010
【标准状态】:现行
【国别】:英国
【发布日期】:2010-11-30
【实施或试行日期】:2010-11-30
【发布单位】:英国标准学会(GB-BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:元部件;机电的;材料;微电子学;微系统工艺;性能;半导体器件;规范(验收);符号;系统工程;拉伸应变;拉伸测试;测试;测试条件;测试装置;薄膜;薄膜工艺
【英文主题词】:Components;Electromechanical;Materials;Microelectronics;Microsystemtechniques;Properties;Semiconductordevices;Specification(approval);Symbols;Systemengineering;Tensilestrain;Tensiletesting;Testing;Testingconditions;Testingdevices;Thinfilms;Thin-filmtechnology
【摘要】:ThispartofIEC62047describesgenericspecificationsformicro-electromechanicalsystems(MEMS)madebysemiconductors,whicharethebasisforspecificationsgiveninotherpartsofthisseriesforvarioustypesofMEMSapplicationssuchassensors,RFMEMS,excludingopticalMEMS,bioMEMS,microTAS,andpowerMEMS.ThisstandardspecifiesgeneralproceduresforqualityassessmenttobeusedinIECQ-CECCsystemsandestablishesgeneralprinciplesfordescribingandtestingofelectrical,optical,mechanicalandenvironmentalcharacteristics.ThispartofIEC62047aidsinthepreparationofstandardsthatdefinedevicesandsystemsmadebymicromachiningtechnology,includingbutnotlimitedto,materialcharacterizationandhandling,assemblyandtesting,processcontrolandmeasuringmethods.MEMSdescribedinthisstandardarebasicallymadeofsemiconductormaterial.However,thestatementsmadeinthisstandardarealsoapplicabletoMEMSusingmaterialsotherthansemiconductor,forexample,polymers,glass,metalsandceramicmaterials.
【中国标准分类号】:K24
【国际标准分类号】:31_080_99
【页数】:24P.;A4
【正文语种】:英语